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everlight electronics co., ltd. technical data sheet high power led -1w ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http:// www.everlight.com rev. 2 page: 1 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo features z feature of the device: small package with high efficiency z color coordinates: x=0.31, y=0.32 according to cie 1931 z typical color temperature: 5700 k. z esd protection. z soldering methods: smt z grouping parameter: total luminous flux, color coordinates. z typical luminous flux: 140 lm @ 1000 ma. z typical optical efficiency: 45lm/w. z the product itself will remain within rohs compliant version. applications z mobile phone flash z exterior and interior illumination applications z decorative and entertainment z exterior and interior automotive illumination materials items description substrate thermally conductive ceramics encapsulating resin silicone resin with phosphor electrodes ag plating die attach silver paste chip ingan
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 2 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo dimensions polarity chip position top view 0,3 0,3 0,4 anode pad bottom view cathode pad 0,5 1,1 1,45 0,25 0,125 optical center 0,725 2,04 1,64 optical center 0.7 anode cathode notes 1. dimensions are in millimeters. 2. tolerances unless dimensions 0.1mm.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 3 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo maximum ratings ( t soldering =25oc ) parameter symbol rating unit dc operating current (torch mode) i f 350 ma pulsed forward current (50ms : on, 950ms : off) i f 1500 ma esd sensitivity (jedec 3b) esd 8000 v junction temperature t j 125 c operating temperature t opr -40 ~ +85 c storage temperature t stg -40 ~ +100 c power dissipation (pulse mode) p d 6.6 w viewing angle (2) 2 1/2 120 deg notes 1. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. view angle measurement tolerance5 electro-optical characteristics (t soldering =25oc) parameter bin symbol min typ. max unit condition luminous flux (1) ---- v 70 85 ---- lm forward voltage (2) v f 3.35 ---- 4.15 v i f =500ma (3) luminous flux (1) ---- v 100 140 ---- lm forward voltage (2) ---- v f 3.35 ---- 4.35 v color temperature ---- cct 4500 ---- 7000 k i f =1000ma
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 4 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo luminous flux characteristics parameter bin symbol min typ. max unit condition j12 100 ---- 110 k11 110 ---- 120 k12 120 ---- 130 n11 130 ---- 140 n12 140 ---- 150 n13 150 ---- 160 n21 160 ---- 170 n22 170 ---- 180 n23 180 ---- 190 n24 190 ---- 200 luminous flux n31 v 200 ---- 225 lm i f =1000ma forward voltage bin parameter bin symbol min typ. max unit condition t1 3.35 ---- 3.85 forward voltage t2 v f 3.85 ---- 4.35 v i f =1000ma notes 1. luminous flux measurement tolerance: 10% 2. forward voltage measurement tolerance: 0.1v 3. the condition i f = 500ma is only for reference. 4. electric and optical data is tested at 50ms pulse condition.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 5 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo color binning rank w1 rank w2 x 0.3738 0.3524 0.344 0.362 x 0.33 0.330 0.344 0.3524 y 0.4378 0.4061 0.342 0.372 y 0.32 0.373 0.342 0.4061 reference cct: 4500k-5000k reference cct: 5000k-5700k rank w3 x 0.303 0.330 0.33 0.311 y 0.333 0.373 0.32 0.292 reference cct: 5700k-7000k notes 1. color coordinates measurement allowance : 0.01 2. color bins are defined at i f = 1000ma and 50ms pulse operation condition. color binning structure graphic representation 0.25 0.30 0.35 0.40 0.45 0.25 0.30 0.35 0.40 0.45 w1 4500 5000 5700 7000 w3 w2 y x
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 6 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo relative spectral distribution, i f =350ma@50ms, t soldering =25oc forward voltage vs. forward current, t soldering =25oc luminous flux vs. forward current, t soldering =25oc forward current derating curve, derating based on t j max =125c at torch mode typical electro-optical characteristics curves 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity(a.u.) forward current(ma@50ms) 0 200 400 600 800 1000 2.4 2.7 3.0 3.3 3.6 3.9 4.2 forward voltage(v) forward current(ma@50ms) 0 200 400 600 800 1000 0 30 60 90 120 150 180 luminous flux(lm) forward current(ma@50ms) 0 255075100 0 100 200 300 400 500 forward current (ma) ambient temperature ( o c)
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 7 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo correlated color temperature (cct) vs. forward current axial illuminance (lux) vs. drive current 0 200 400 600 800 1000 6000 6400 6800 7200 7600 corelated color temperatrue(k) forward current(ma@50ms) 0 200 400 600 800 1000 0 10 20 30 40 50 60 illuminance at 1m distance (lux) forward current (ma@50ms) notes all correlation data is tested under superior thermal management with 1? x 1? mcpcb. typical representative spatial radiation pattern -90 -60 -30 0 30 60 90 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity(a.u.) 2q (degree) x axis y axis
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 8 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: luminous flux hue: chromaticity coordinates ref: forward voltage lot no: lot number made in taiwan: production place reel dimensions notes 1. dimensions are in millimeters. 2. the tolerances unless mentioned is 0.1mm.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 9 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo carrier tape dimensions: loaded quantity 2000 pcs per reel polarity progress direction notes 1. dimensions are in millimeters. 2. the tolerances unless mentioned is 0.1mm. moisture resistant packaging
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 10 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo reliability test items stress test stress condition stress duration reflow t sol =260c, 10sec, 6min 3 times dc operating life t a =25c , i f =350ma 1000 hours thermal shock h 100c 20min. ' 10sec. 'l 40c 20min. 500 cycles temperature cycle h 100c 30min. ' 5min. 'l 40c 30min. 1000 cycles high temperature/humidity t a =85c , rh=85% 1000 hours high temperature storage t a =100c 1000 hours low temperature storage t a =-40c 1000 hours pulse test t a =25c, i f =1000ma 400ms on/ 3600ms off 30000 times high temperature /humidity operation life t a =85c, rh=85%, 1000 hours esd human body model 8000v, interval:0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 50% * v f : forward voltage difference 20% notes: all reliability items are tested under superi or thermal management with 1? x 1? mcpcb.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 11 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo precautions for use 1. over-current-proof though ehp-c04 has conducted esd protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen. 2. storage i. do not open moisture proof bag before the products are ready to use. ii. before opening the package, the leds should be stored at temperature less than 30c and less and relative humidity less than 90%. iii. the leds should be used within a year with the completely package. iv. after opening the package, the leds should be stored at temperature less than 30c and relative humidity less than 70%. v. the leds should be used within 168 hours (7 day) after the package was opened. vi. if the moisture absorbent material (silicone gel) has faded away or the leds have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 605c for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-c04 series leds should be mounted on a metal core printed circuit board (mcpcb), with proper thermal connection to dissipate approximately 1w to 5w of thermal energy under normal operation. ii. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and leds lifetime will decrease critically.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 12 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo 4. soldering condition 4-1. soldering pad 4-2. for reflow process i. lead reflow soldering temperature profile ii. reflow soldering should not be done more than two times. iii. while soldering, do not put stress on the leds during heating. iv. after soldering, do not warp the circuit board.
everlight electronics co., ltd. ehp-c04/nt01a-p01/tr everlight electronics co., ltd. http ://www.everlight.com rev. 2 page: 13 of 13 device no. : dhe-0000878 prepared date: aug. 06.2010 prepared by: shower kuo 5. soldering iron i. for prototype builds or small series production runs it is possible to place and solder the led by hand. ii. dispensing thermal conductive glue or grease on the substrates and follow its curing spec. press led housing to closely connect led and substrate. iii. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. iv. be careful because the damage of the product is often started at the time of the hand solder.

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